technical program committee
Technical Program Committee Co-chairs
Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA
Xue Liu, McGill University, Canada
Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA
Xue Liu, McGill University, Canada
Technical Program Committee Members
Tarek Abdelzaher, University of Illinois at Urbana-Champaign, USA
Giuseppe Anastasi, University of Pisa, Italy
Allen Au, The Hong Kong Polytechnic University, Hong Kong
Paul Baumann, Technical University, Dresden
Christian Becker, University of Mannheim, Germany
Paolo Bellavista, University of Bologna, Italy
Torsten Braun, University of Bern, Switzerland
Sriram Chellappan, University of South Florida, USA
Danny Chen, University of Notre Dame, USA
Sinem Coleri Ergen, Koc University, Turkey
Sajal Das, Missouri University of Science and Technology, USA
Debraj De, Missouri University of Science and Technology, USA
Alessandra De Paola, Università degli Studi di Palermo, Italy
Mario Di Francesco, Aalto University, Finland
Gianluca Dini, University of Pisa, Italy
Sameh Elnikety, Microsoft Research, USA
Feng Gao, Tsinghua University, China
Giacomo Ghidini, University of Texas at Arlington, USA
Yu (Jason) Gu, IBM Watson Health, USA
Nan Guan, The Hong Kong Polytechnic University, Hong Kong
Song Guo, The Hong Kong Polytechnic University, Hong Kong
Mohammad Hajiesmaili, Chinese University of Hong Kong, Hong Kong
Qi Han, Colorado School of Mines, USA
Takahiro Hara, Osaka University, Japan
Yu Hua, Huazhong University of Science and Technology, China
Andrew Hudson-Smith, University College London, UK
Pan Hui, The Hong Kong University of Science and Technology, Hong Kong
Xiaohua Jia, City University of Hong Kong, Hong Kong
Hai Jin, Huazhong University of Science and Technology
Fanxin Kong, McGill University, Canada
Linghe Kong, Shanghai JiaoTong University, China
Mohan J Kumar, Rochester Institute of Technology, USA
Baochun Li, University of Toronto, Canada
Xiaozhou Li, Google, USA
Harold Liu, Beijing Institute of Technology, China
Jiangchuan Liu, Simon Fraser University, Canada
Chenyang Lu, Washington University in St. Louis, USA
Ed Manley, University College London, UK
Francesco Marcelloni, University of Pisa, Italy
Alan Marchiori, Bucknell University, USA
Enzo Mingozzi, University of Pisa, Italy
Paolo Nesi, University of Florence, Italy
Marco Ortolani, University of Palermo, Italy
Kyung-Joon Park, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Korea
Andrea Passarella, IIT-CNR, Italy
Dirk Pesch, Cork Institute of Technology, Ireland
Chen Qian, University of Santa Cruz,
Kiran Rachuri, Samsung Research, USA
Andreas Reinhardt, Clausthal University of Technology, Germany
Shaolei Ren, University of California Riverside, USA
Francesco Restuccia, Missouri University of Science and Technology, USA
Chunming Rong, University of Stavanger, Norway
Nirmalya Roy, University of Maryland Baltimore County, USA
Abusayeed Saifullah, Missouri University of Science and Technology, USA
Zili Shao, The Hong Kong Polytechnic University, Hong Kong
Simone Silvestri, Missouri University of Science and Technology, USA
Neeraj Suri, Technische Universität Darmstadt, Germany
Athena Vakali, Aristotle University, Greece
Nalini Venkatasubramanian, University of California at Irvine, USA
Enrico Vicario, University of Florence, Italy
Sheng Wen, Deakin University, Australia
Weigang Wu, Sun Yat-sen University, China
Xiaohui Xiong, Chevron Corporation, USA
Jianliang Xu, Hong Kong Baptist University, Hong Kong
Na Yu, QualComm Research, USA
Zhiwen Yu, Northwestern Polytechnical University, China
Dian Zhang, Shenzhen University, China
Lei Zhang, The Hong Kong Polytechnic University, Hong Kong
Yongping Zheng, The Hong Kong Polytechnic University, Hong Kong
Quanyuan Zhu, New York University, USA
Eugenio Zimeo, University of Sannio, Italy
Albert Zomaya, The University of Sydney, Australia
Tarek Abdelzaher, University of Illinois at Urbana-Champaign, USA
Giuseppe Anastasi, University of Pisa, Italy
Allen Au, The Hong Kong Polytechnic University, Hong Kong
Paul Baumann, Technical University, Dresden
Christian Becker, University of Mannheim, Germany
Paolo Bellavista, University of Bologna, Italy
Torsten Braun, University of Bern, Switzerland
Sriram Chellappan, University of South Florida, USA
Danny Chen, University of Notre Dame, USA
Sinem Coleri Ergen, Koc University, Turkey
Sajal Das, Missouri University of Science and Technology, USA
Debraj De, Missouri University of Science and Technology, USA
Alessandra De Paola, Università degli Studi di Palermo, Italy
Mario Di Francesco, Aalto University, Finland
Gianluca Dini, University of Pisa, Italy
Sameh Elnikety, Microsoft Research, USA
Feng Gao, Tsinghua University, China
Giacomo Ghidini, University of Texas at Arlington, USA
Yu (Jason) Gu, IBM Watson Health, USA
Nan Guan, The Hong Kong Polytechnic University, Hong Kong
Song Guo, The Hong Kong Polytechnic University, Hong Kong
Mohammad Hajiesmaili, Chinese University of Hong Kong, Hong Kong
Qi Han, Colorado School of Mines, USA
Takahiro Hara, Osaka University, Japan
Yu Hua, Huazhong University of Science and Technology, China
Andrew Hudson-Smith, University College London, UK
Pan Hui, The Hong Kong University of Science and Technology, Hong Kong
Xiaohua Jia, City University of Hong Kong, Hong Kong
Hai Jin, Huazhong University of Science and Technology
Fanxin Kong, McGill University, Canada
Linghe Kong, Shanghai JiaoTong University, China
Mohan J Kumar, Rochester Institute of Technology, USA
Baochun Li, University of Toronto, Canada
Xiaozhou Li, Google, USA
Harold Liu, Beijing Institute of Technology, China
Jiangchuan Liu, Simon Fraser University, Canada
Chenyang Lu, Washington University in St. Louis, USA
Ed Manley, University College London, UK
Francesco Marcelloni, University of Pisa, Italy
Alan Marchiori, Bucknell University, USA
Enzo Mingozzi, University of Pisa, Italy
Paolo Nesi, University of Florence, Italy
Marco Ortolani, University of Palermo, Italy
Kyung-Joon Park, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Korea
Andrea Passarella, IIT-CNR, Italy
Dirk Pesch, Cork Institute of Technology, Ireland
Chen Qian, University of Santa Cruz,
Kiran Rachuri, Samsung Research, USA
Andreas Reinhardt, Clausthal University of Technology, Germany
Shaolei Ren, University of California Riverside, USA
Francesco Restuccia, Missouri University of Science and Technology, USA
Chunming Rong, University of Stavanger, Norway
Nirmalya Roy, University of Maryland Baltimore County, USA
Abusayeed Saifullah, Missouri University of Science and Technology, USA
Zili Shao, The Hong Kong Polytechnic University, Hong Kong
Simone Silvestri, Missouri University of Science and Technology, USA
Neeraj Suri, Technische Universität Darmstadt, Germany
Athena Vakali, Aristotle University, Greece
Nalini Venkatasubramanian, University of California at Irvine, USA
Enrico Vicario, University of Florence, Italy
Sheng Wen, Deakin University, Australia
Weigang Wu, Sun Yat-sen University, China
Xiaohui Xiong, Chevron Corporation, USA
Jianliang Xu, Hong Kong Baptist University, Hong Kong
Na Yu, QualComm Research, USA
Zhiwen Yu, Northwestern Polytechnical University, China
Dian Zhang, Shenzhen University, China
Lei Zhang, The Hong Kong Polytechnic University, Hong Kong
Yongping Zheng, The Hong Kong Polytechnic University, Hong Kong
Quanyuan Zhu, New York University, USA
Eugenio Zimeo, University of Sannio, Italy
Albert Zomaya, The University of Sydney, Australia